Category: PCB

Surface Finish

Surface Finish Process Description HASL (Hot Air Solder Leveled) Leaded Solder The process deposits leaded solder on PCB features that Solder Mask has left uncovered. Solder thickness may vary from 0.2 mils to 1.2 mils. The variation depends on the density of circuit board. Solder is 63%/37% eutectic Tin/Lead. HASL (Hot Air Solder Leveled) Lead-Free […]

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RoHS Compliance

Rush PCB Inc offers customers PCBs and PCB assemblies compliant with RoHS directives. This includes: High Tg FR406 and other High Performance Materials Lead-Free Surface Finishes High Tg FR406 Material from Rush PCB Inc We have formulated our high Tg FR406 material for superior performance, especially through multiple thermal excursions. It passes 6x solder tests […]

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LED PCB Boards and Assemblies

LED PCB boards have unique specifications, especially for containing spillover light and for managing heat dissipation from LEDs. A PCB fabricator must completely adhere to the specifications to make a success of the project. At Rush PCB Inc, we have the necessary technology to make high quality LED PCB boards and assemblies. Spillover Light When […]

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Laser Drilled Micro-Vias

HDI and Micro-Vias PCB fabricator must keep up with the steadily decreasing size of PCBs and their increasing complexities. Simultaneously, designers must constantly revise old processes, add new ones, and include those necessary for High Density Interconnect or HDI. As a PCB fabricator, Rush PCB Inc works constantly to stay on top of the game. […]

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High Density Interconnects (HDI)

HDI PCB Manufacturer PCBs with High Density Interconnect technology are now commonplace in the miniature electronic products like tables, wearables, and smart devices. Rush PCB Inc incorporates HDI technology in the basic PCB fabrication and the way the components connect to it. However, limiting the HDI technology to just the interconnections between various printed circuit […]

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RUSH PCB Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.