Category: Mobile

Camera Module

Manufacturer RUSHPCB Base 1mil(25um) 1/3oz ED Drill Size 0.15Ø PSR BLACK Application Camera Module Coverlay 1mil (25um) PrePreg 3mil (80um) * 2  Final Thickness 0.35T Layer RF 4-2-4 Kit Size 160 * 80 PNL Size   Unit per m2   Surface Treatment ENEPIG Gold Plating Thickness NI : 5~15um, Pd-P:0.08~0.2um, Au Min 0.1um Remarks 21M

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Camera Module

Manufacturer RUSHPCB Base 1/2mil(25um) 1/3oz ED Drill Size 0.15Ø PSR GREEN Application Camera Module Coverlay 2mil (40um) PrePreg 3mil (80um) * 2  Final Thickness 0.4T Layer RF 4-2-4 Kit Size 180 * 75 PNL Size   Unit per m2   Surface Treatment ENEPIG Gold Plating Thickness NI : 5~15, Pd-P:0.08~0.2mh, Au Min 0.1mh Remarks 8M

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Ear-Jack

Manufacturer RUSHPCB Base 1/2mil(13um) 1/2oz ED Drill Size 0.2Ø PSR BLUE Application Ear-Jack Coverlay 1mil (25um) PrePreg 1mil (25um) Final Thickness 0.37T Layer RF 4-2-4 Kit Size 250 * 130 PNL Size   Unit per m2   Surface Treatment ENIG Gold Plating Thickness Au Min 0.05mh NI : 3~5mh Remarks  

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Ear-Jack

Manufacturer RUSHPCB Base 1/2mil(13um) 1/2oz ED Drill Size 0.2Ø PSR RED Application Ear-Jack Coverlay 1mil (25um) PrePreg 1mil (25um) Final Thickness 0.37T Layer RF 4-2-4 Kit Size 250 * 121 PNL Size   Unit per m2   Surface Treatment ENIG Gold Plating Thickness Au Min 0.05mh NI : 3~5mh Remarks  

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Micro

Manufacturer RUSHPCB Base CCL 0.1T 1/2 oz Drill Size 0.15Ø PSR Blue/ Black Application MICRO Coverlay   PrePreg   Final Thickness 0.3T Layer H PCB 2L Kit Size 208 * 75 PNL Size   Unit per m2   Surface Treatment Electro Gold Plating Gold Plating Thickness Au Min 0.3mh NI : 4~7mh Remarks Etching Back, […]

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RUSH PCB Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.