Flex and Rigid Flex

Flex and Rigid Flex

FLEX + RIGID HYBRID BOARD

FR4 & POLYIMIDE KAPTON THICK


FLEXIBLE BOARD

FR4 & POLYIMIDE KAPTON THICK


BLIND & BURRIED 1+FLEX+1 LASER DRILL

Material:
  • Flex:L2~L3 TU-768:L1~L0 L0~L4
  • Laser:L4~L0 laser via:0.006″
  • Dielec tricthickness: 0.0035″~0.0045″
  • No VIPPO

CONSTRUCTION MATERIALS

Material Type

  • PI thic:1~3mils
  • Coverlay thic:2mils
  • Ink thic:0.5~0.9mils
  • Adhesive thic:1~2mils (Polyester)
  • Nonflow PP 47N 49N thic:2.5mils
  • Stiffener PI FR4 AL
  • Copper ED RA
  • EMI SF-PC5500 thic:0.6~0.8mils
  • Cu + adhesive thic:2.4mils

Blind vias

  • Copper windowing
  • Laser via
  • Copper plating
  • Coverlay/Soldermask
  • Fab.: CNC, Laser cutting
  • Stiffener

FLEX MAIN EQUIPMENTS

PRECISION HOT-AIR OVENLDI
LASER CUTTINGMASS. LAM. FOR FLEX AND COVER LAY

MATERIAL ALUMINUM & FLEX BASE

Material :
FR4-ISOLA370HR Aluminium flex

CAPABILITY

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RUSH PCB Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.