HDI Capability

HDI Capability

HDI Technology in Hole


High Density Interconnection


Blind & Burried 9+2+9 Laser Drill


Market Trend vs. Technology Solution


HDI Process Flow


Main Process of Build – up Layer


Construction Materials

MATERIAL TYPE

  • FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
  • FR 4 High Tg ( Tg. 160 – 180 ℃ )
  • RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
  • Ink ( VIL )

Comparison of Material

 PrepregRCC
Low Cost++
Strength+++
Hole wall roughness+
Laminating control+
Dielectric thickness45um ~30um ~ 80um
Smear residue on target pad++
Dielectric constant3.9 ~ 4.73.2 ~ 3.8
Shelf time+++
Working PNL size+++

Comparison of Via Technologies

 Mechanical DrillingLaser Drilling
Low Cost in Equipment+++
Low Cost in Production+++
Required FacilitiesDrilling MachineLaser Machine
ConsumableDrill Bits, Backup BoardNone
Aspect Ratio91
Via Size Capacity200 um~50~100um
Speed140 H/min20,000 H/min
Throughput+

Comparison of Blind Via

PREPREGRCC

Build-up for 2 + N + 2

THROUGH HOLEINNER LASER VIASTACK HOLE
INNER VIA HOLESURFACE LASER VIA

Laser Via Quality


1+6+1 without buried, extend to 1+N+1


1+4+4+1 with buried via, extend to 1+N+N+1


Black Oxide Treatment


D.F. Strip


Etching


D.F. Exposure / Developing


Dry Film Lamination


I.V.H.Grinding( for thickness >= 60 mil )


I.V.H.Grinding( for thickness >= 60 mil )


Electro Plating


Electroless Copper Plating


I.V.H.(Inner Via Hole) Drilling


I.V.H.(Inner Via Hole) Drilling


Blind via Capability


2+4+2 Staggered via, extend to 2+N+2


2+4+2 laser via on laser via


Solder Mask Printing


Dry Film Lamination


Lamination


Prepreg Layup


Black Oxide Treatment


D.F. Exposure / Developing


Dry film, Exposure & DES


Electro Plating


Desmear / Electroless Copper Plating


Laser Drilling for Blind Via


D.F. Strip


Etching


D.F. Exposure / Developing


S/M Exposure / Developing


Surface Finish


Symbol Mask Printing


Inspection

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Looking for an expert solution for your company?

RUSH PCB Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.